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PI tape, UV tape, Dicing tape, Back Grinding Tape, Wafer, Thermal-off adhesive tape, heat sink, QFN tape, anti-static tape, Acrylic tape...
2019-04-15
Punch Service
To match the customized dimension, the product can be applied for extra process as punching, laminating and slitting...
2019-02-27
PI Tape (Polyimide tape)
Polyimide film-based tape, widely used in high temperature processes,with high heat resistance and dimensional stability
2019-04-09
Wafer
Silicon Integrated Circuits
2019-04-10
Heat Sink(customized)
The heat sink can be attached to the surface of the heating element and is currently one of the most popular products.
2019-04-15
EMI shielding Material
The conductive paste is ideal material for creating EMI shielding effectiveness on the product.
2019-04-15
Back Grinding Tape
The back grinding tape can protect the wafer surface circuits and prevent damage while wafer back side grinding process.
2019-04-15
Reinforcing plate
Reinforcing plate
2019-04-15
Dicing Tape
While the tape is applied to the dicing process, it can fix the chip to prevent the occurrence of flying chip.
2019-04-15
Thermal Release Tape
It can fix the product & substrate while high temperature process. The tape can be peeled off by rising up temp.
2019-04-15
Insulation Tape
Insulation Tape
2019-04-15
Carrier tape
Carrier tape
2019-04-15
Antistatic tape
Antistatic tape
2019-04-15
Graphite Sheet
Graphite Sheet
2020-04-22
High Performance Laser Debond Film
2019-04-15
Pb free Solder paste
Pb free Solder paste
2019-04-15
BGA
BGA
2019-04-15
Nanometer (nm) Ag
Nanometer (nm) Ag
2019-04-15
Cleanroom shoes
Clean shoesCleanroom shoes
 
 
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Kyocera Double Color KJ4B-0300 Prin
  Kyocera Double Color KJ4B-0300 Printhead ...
Kyocera KJ4B-QA06NTB-STDV Printhead
  Kyocera KJ4B-QA06NTB-STDV Printhead ...
Kyocera UV KJ4A-RH Printhead
  Kyocera UV KJ4A-RH Printhead ...
Kyocera Waterbased KJ4B-Z Printhead
  Kyocera Waterbased KJ4B-Z Printhead ...
SINAR DUNIA COPY PAPER
  SINAR DUNIA COPY PAPER ...
 
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