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| Heat Sink(customized) |
| The heat sink can be attached to the surface of the heating element and is currently one of the most popular products. |
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| Wafer |
| Silicon Integrated Circuits |
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| EMI shielding Material |
| The conductive paste is ideal material for creating EMI shielding effectiveness on the product. |
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| Punch Service |
| To match the customized dimension, the product can be applied for extra process as punching, laminating and slitting... |
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| Back Grinding Tape |
| The back grinding tape can protect the wafer surface circuits and prevent damage while wafer back side grinding process. |
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| Thermal Release Tape |
| It can fix the product & substrate while high temperature process. The tape can be peeled off by rising up temp. |
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